PCB Fabrication is one of our primary services, which is also known as PCB Manufacturing, PCB Printing Service. All our services are under NDA(Fortrolighedsaftale) Protection which makes you stay away from intellectual property concern. Below are the PCB types we manufacture.

Lead Time(Days)

Single/double side 4 layer 6 layer over 8 layer HDI
Sample lead time(Normal) 5-6 6-7 7-8 10-12 15-20
Sample lead time(Fastest) 48-72 hours 5 6 6-7 12
Mass production lead time(First batch) 7-9 10-12 13-15 16 20

PCB Fabrication Capability

PCB Fabrication Capability
No Item PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purpleblack
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (mm) 620*813 (24″*32″)
7 Max. working panel size (mm) 620*900 (24″x35.4″)
8 Max. board thickness (mm) 12
9 Min. board thickness(mm) 0.3
10 Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ; T≥1.00mm: +/-10%
11 Registration tolerance (mm) +/-0.10
12 Min. mechanical drilling hole diameter (mm) 0.15
13 Min. laser drilling hole diameter(mm) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(mm) L≤10, 0.15;L=12-22,0.175L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 Min. Inner layer clearance(mm) 0.15
17 Min. hole edge to hole edge space(mm) 0.28
18 Min. hole edge to profile line space(mm) 0.2
19 Min. Inner layer copper to profile line space (mm) 0.2
20 Registration tolerance between holes (mm) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420 (12oz)
Inner Layer: 210 (6oz)
22 Min. trace width (mm) 0.075 (3mil)
23 Min. trace space (mm) 0.075 (3mil)
24 Solder mask thickness (um) line corner: >8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness (um) 3-15
35 profile size tolerance (mm) ±0.08
36 Max. solder mask plugging hole size (mm) 0.7
37 BGA pad (mm) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (mm) +/-0.10
39 V-CUT position tolerance (mm) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width (mm) 0.1
44 Fire flame class 94V-0
Special for Via in pad boards Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
different hole size in one board? yes
Max. panel size (finished) (mm) 880 ×580
Max. working panel size (mm) 914 × 602
Max. board thickness (mm) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Ja
Tolerance of back drill (mm) ±0.05
Tolerance of press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 x 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Ja
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (mm) 0.075
Max. dielectric thickness (mm) 0.15
Min. dielectric thickness (mm) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (mm) Hole size+0.15
Top side Pad size ( on micro-via) (mm) Hole size+0.15
Copper filling or not (yes or no) (mm) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
Min. via size can be copper filled (mm) 0.1
Max. stack times 4