PCB Fabrication is one of our primary services, which is also known as PCB Manufacturing, PCB Printing Service. All our services are under NDA(非開示合意) Protection which makes you stay away from intellectual property concern. Below are the PCB types we manufacture.

Lead Time(Days)

Single/double side 4 layer 6 layer over 8 layer HDI
Sample lead time(Normal) 5-6 6-7 7-8 10-12 15-20
Sample lead time(Fastest) 48-72 hours 5 6 6-7 12
Mass production lead time(First batch) 7-9 10-12 13-15 16 20

PCB Fabrication Capability

PCB Fabrication Capability
No Item PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purpleblack
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (ミリメートル) 620*813 (24″*32″)
7 Max. working panel size (ミリメートル) 620*900 (24″x35.4″)
8 Max. board thickness (ミリメートル) 12
9 Min. board thickness(ミリメートル) 0.3
10 Board thickness tolerance (ミリメートル) T<1.0 ミリメートル: +/-0.10ミリメートル ; T≥1.00mm: +/-10%
11 Registration tolerance (ミリメートル) +/-0.10
12 Min. mechanical drilling hole diameter (ミリメートル) 0.15
13 Min. laser drilling hole diameter(ミリメートル) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(ミリメートル) L≤10, 0.15;L=12-22,0.175L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 Min. Inner layer clearance(ミリメートル) 0.15
17 Min. hole edge to hole edge space(ミリメートル) 0.28
18 Min. hole edge to profile line space(ミリメートル) 0.2
19 Min. Inner layer copper to profile line space (ミリメートル) 0.2
20 Registration tolerance between holes (ミリメートル) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420 (12oz)
Inner Layer: 210 (6oz)
22 Min. trace width (ミリメートル) 0.075 (3mil)
23 Min. trace space (ミリメートル) 0.075 (3mil)
24 Solder mask thickness (um) line corner: >8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness (um) 3-15
35 profile size tolerance (ミリメートル) ±0.08
36 Max. solder mask plugging hole size (ミリメートル) 0.7
37 BGA pad (ミリメートル) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (ミリメートル) +/-0.10
39 V-CUT position tolerance (ミリメートル) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width (ミリメートル) 0.1
44 Fire flame class 94V-0
Special for Via in pad boards Resin plugged hole size (min.) (ミリメートル) 0.3
Resin plugged hole size (max.) (ミリメートル) 0.75
Resin plugged board thickness (min.) (ミリメートル) 0.5
Resin plugged board thickness (max.) (ミリメートル) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (ミリメートル) 0.4
different hole size in one board? yes
Max. panel size (finished) (ミリメートル) 880 ×580
Max. working panel size (ミリメートル) 914 × 602
Max. board thickness (ミリメートル) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 ミリメートル)
Line wide/space (ミリメートル) 0.075/ 0.075
Back drill capability はい
Tolerance of back drill (ミリメートル) ±0.05
Tolerance of press fit holes (ミリメートル) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (ミリメートル) 0.2
Dielectrical thickness (ミリメートル) 0.025
Working Panel size (ミリメートル) 350 x 500
Line wide/space (ミリメートル) 0.075/ 0.075
Stiffener はい
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (ミリメートル) 0.075
Max. dielectric thickness (ミリメートル) 0.15
Min. dielectric thickness (ミリメートル) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (ミリメートル) Hole size+0.15
Top side Pad size ( on micro-via) (ミリメートル) Hole size+0.15
Copper filling or not (yes or no) (ミリメートル) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
Min. via size can be copper filled (ミリメートル) 0.1
Max. stack times 4